?Prof. Ricky Lee received his BSc and MSc degrees from National Taiwan
University and Virginia Polytechnic Institute & State University,
respectively. In 1992, he graduated from Purdue University with a PhD degree in
Aeronautical & Astronautical Engineering. After one year of post-doctoral
research at Purdue, he joined the Hong Kong University of Science &
Technology (HKUST). During his career of tenure-track faculty at HKUST, Prof.
Lee once was on secondment to serve as Chief Technology Officer of Nano &
Advanced Materials Institute (NAMI) for two and a half years. Currently Prof.
Lee is Chair Professor of Mechanical and Aerospace Engineering and Director of
Center for Advanced Microsystems Packaging (CAMP) at HKUST. He also has
concurrent appointments as Dean of HKUST Fok Ying Tung Graduate School,
Director of HKUST Nanhai Innovation Center, and Director of HKUST LED-FPD
Technology R&D Center at Foshan, Guangdong, China. Prof. Lee has been
focusing his research on the development of packaging and assembly technologies
for electronics and optoelectronics. The topics of his R&D interests
include wafer level packaging and 3D IC integration, through silicon vias (TSV)
and high density interconnects, LED packaging for solid-state lighting,
lead-free soldering and reliability analysis. The research outcomes of Prof.
Lee’s group have been documented in numerous technical papers in international
journals and conference proceedings. He also co-authored 3 books and 9 book
chapters. Due to his technical contributions, Prof. Lee received many honors
and awards over the years. In addition to being the recipient of 12
best/outstanding paper awards and 6 major professional society awards, Prof.
Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also
an IEEE EPS Distinguished Lecturer.